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Wire Bond Surface Coining Base Transistor Outline Package

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JOPTEC LASER CO., LTD

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Name: Wire Bond Surface Coining Base Transistor Outline Package
Brand: JOPTEC
Price: 1 USD

Brand Name : JOPTEC

Place of Origin : HEFEI, CHINA

MOQ : 50 PCS

Payment Terms : T/T

Supply Ability : 5000000 PCS/Month

Delivery Time : 30 Days

Packaging Details : Boxes

Base : 4J29

Glass insulator : BH-A/K

Insulation Resistance : 500V

Leak rate : ≤1*10^-3Pa.cm3/s

Shell adopt material : FeNiCo,FeNi42 or CRS;

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Product Name	Robust Coining Base with A Large Diameter Wire Bond Surface
Product Model	JOPTEC
Plating Coating	Fully plating Au or selective plating Au
Finish	Shell and pins are plated Ni:2~11.43um and Au≥1.3um;Cap is plated Ni:2~11.43um
Product Formation	Material	Quantity
1. Base	4J29	1
2. Glass insulator	BH-A/K	8
3. Pin	4J29	8
4. Cap	4J42	1
Insulation Resistance	500V DC resistance between all the pins linked and base is ≥1*10^⁹Ω
Hermeticity	Leak rate is ≤1*10^^-3Pa.cm³/s
Product Features	1. Shell adopt material: FeNiCo,FeNi42 or CRS;
	2. The shape of pin is cyclinder and straight,material adopts Kovar.The shape of pin used as bonding is cyclinder or nailhead.
	3. The sealing cap method is percussion welding or tin welding.
	4. The rank of pin which cross the bottom of base could be choosen by customers.
	5. The position of ground pin can be choosen by customer.
	6. The design of caps need to fit the shell.
	7. Customer could choose shell fully plating or pin selective plating.

Product Tags:

8pin Transistor Outline header

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